Mattson Tech readies first ICP/etch system

Electronic News, July 8, 1996

Fremont, Calif.--Mattson Technology is introducing its first etch system based on the company's patented inductively coupled plasma (ICP) source technology, promising to have it on the floor at next week's Semicon/West. The Aspen LiteEtch is aimed at isotropic etch applications including bond pad etch, isotropic contact and via etch, silicon light etch and selective silicon nitride mask removal.

"Our customers have indicated that the most significant consideration when purchasing new processing equipment is cost of ownership," said Brad Mattson, president and CEO of the company. "The second consideration is wafer damage. Aspen LiteEtch combines the high throughput of the Aspen platform with our advanced ICP technology to provide the lowest cost of ownership and highest yields of any isotropic etch system in the industry."

Mattson Technology is applying its ICP source technology to etch applications with better etch rate uniformity, greater profile control and selectivity and very low wafer damage. Because the ICP source produces a plasma remote from the wafer with very low ionization, charging (and therefore device damage) is eliminated and contamination drive-in at the wafer surface is significantly minimized.

The product's three applications mean competition from a number of companies, according to Bernie Wood, product marketing manager at Mattson. GaSonics International, Shibaru and Tokyo Ohka Kogyo (TOK) vie for market share in isotropic etch; Lam Research, Tegal and Applied Materials are the contenders for bond pad etch; and the silicon mask capability draws fire from wetbench application companies.

"LiteEtch is used for all three applications in R&D fabs and small fabs, but in larger fabs, the customer will usually dedicate the system to one application," said Mr. Wood. "The product is part of a joint development program with a major U.S. semiconductor manufacturer, to which a full-revenue system is shipping this week. Production units will be shipping six months ARO. Single-chamber systems start at $550,000, with dual-chamber systems going for around $850,000, depending on options."

With two stations per chamber, the single chamber is a multi-option design, all based on the field-proven Aspen platform, more than 250 of which are out in the field.

The potential benefits of using chemical dry etch processing rather than wet processing include increased process control and repeatability. In addition, elimination of wet chemicals provides environmental benefits, increased safety and lower cost of ownership.

The platform can support multiple process chambers and process up to four wafers simultaneously. It has demonstrated throughput of 60-90 wafers per hour with one chamber, and 100-150 wafers per hour with dual chambers.