Tencor to ship profiler for planarized metal films

Electronic News, Oct 14, 1996

Mountain Vview, Calif.--Entering the submicron metal chemical mechanical planarization (CMP) arena, Tencor Instruments introduced a metrology system combining the reliability of its existing surface profilers with the fine-feature analysis and rendering capabilities previously found only in laboratory-oriented products.

Offering the measurement capabilities needed to monitor a semiconductor wafer both before and after complex processes like CMP, the new Tencor HRP-200 high-resolution profiler is designed to perform automated, in-process planarization monitoring of semiconductor wafers with device geometries as small as 0.25-micron.

According to the company, the HRP-200 is the first metrology system to combine in one instrument the ability to measure a surface on both the macroscopic (i.e., 500 millimeters) and microscopic (i.e., 0.25 micron) scale. The HRP-200's fine-resolution capabilities allow device manufacturers to optimize the CMP process by measuring characteristics like tungsten plug recess (including plotting the distance between multiple recessed plugs), pattern-induced erosion, dishing of metal features and scratching of inter-layer dielectric (ILD) films.

"The Tencor HPR-200 is designed to provide IC makers with a unique solution that offers the best of both worlds, engineering-quality data in a production-worthy system," said Dennis Fortini, Tencor VP and Metrology division GM, emphasizing the new system as an important addition to the division's product offerings. "In addition, while our existing profilers continue to be appropriate for oxide CMP applications, this product is specifically intended for submicron metal CMP process monitoring, a new market for Tencor."

The HPR-200's proprietary dual stage imaging (DSI) technology uses both sensor and sample imaging stages, giving the system its macro-to-micro imaging capability. The new system also features improved lateral scanning resolution to 1 nanometer, enabling it to capture more surface detail between scans.

Currently in beta test with several key customers, the new system is scheduled to begin production shipments by early 1997. Base pricing starts at $395,000.