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Automotive Industry

Conductive adhesives - In Gear - New low-shrink and non-shrink epoxy - Brief Article - Product Announcement

Automotive Design & Production, June, 2002

Who: Devcon (Danvers, MA)

What: Syon electrically conductive adhesives/potting compounds

Why you should care: These products can be used to form conductive paths in applications where hot soldering cannot be used effectively. Devcon claims that the adhesives/potting compounds offer exceptional thermal conductivity and can be used to seal electrical components or wiring where heat dissipation is required.

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Pertinent Data: The compounds are low-shrink and non-shrink epoxy and epoxide formulations which pour easily, fill voids completely and cure with little air entrapment. They include: Syon Tru-Bond 206A conductive adhesive solder which is a pourable liquid for bonding electrical components that might be damaged by hot solder; Tru-Bond 214 Silver-Filled Epoxy Adhesive--a non-sagging paste used where conductive bonds are needed but soldering is impractical; Tru-Bond 215 Copper-Filled Epoxy--a non-sagging paste offered as a lower cost alternative to silver-filled products.

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Automotive Industry

Conductive adhesives - In Gear - New low-shrink and non-shrink epoxy - Brief Article - Product Announcement

Automotive Design & Production, June, 2002

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