NEPCON WORLD JAPAN 2008 - Asia's Largest Show for Electronics Design, R&D and Manufacturing to be Held January 16-18

JCN Newswires, Jan 10, 2008

Tokyo, Japan, Jan 10, 2008 - (JCN Newswire) - NEPCON WORLD JAPAN is the Asia's largest exhibition which gathers various electronics manufacturing and SMT-related products and technologies; and also semiconductor packaging technologies, components and materials; PCBs; test, inspection and measuring equipments, industrial laser and optical components; and so on. Recognized as an essential business venue for industry professionals not only in Japan but even from all over the world, this years edition will be held January 16-18, 2008 at Tokyo Big Sight, Japan.

Since its launch in 1972, the show has been growing together with the Japanese electronics industry and will be its 37th this time. Expanding year by year, NEPCON WORLD JAPAN 2008 will be held in record-scale ? gathering 1,200 exhibitors (1,007 exhibitors in 2007) and 60,000 visitors (56,498 visitors in 2007), NEPCON WORLD JAPAN is known for its exhibitors ? all the TOP companies are exhibiting. Each exhibitor presents their latest products and technologies actively with detailed demos. Further more, every year many exhibitors develop new products and technologies to announce at NEPCON WORLD JAPAN. Visitors can compare products, the most advanced technologies, and gather information to find solutions to their needs.

Recently, the situation surrounding the electronics industry in Japan has been showing drastic changes with the spread of flat-screen television, technical advancements in cell phones, mobile devices, and automotive electronics. It attracts great interest from all over the world. Following such trends, NEPCON WORLD JAPAN gathers great attention from industry professionals as a bridge connecting Japan and the World's electronics industry.

NEPCON WORLD JAPAN 2008 will feature 3 keynote sessions to be held with the most refined speakers. There are also technical sessions covering the latest industry trends and technical issues.

INTERNEPCON JAPAN Keynote Session - Jan. 16, 2008, 10:30-12:30

"Advancements in Surface Finishing and Packaging Technology"

Dr. Hideo Honma, Chief Director, Surface Engineering Research Institute, Kanto Gakuin University

"Recollections from the Early Years of Semiconductor Technology"

Dr. Makoto Kikuchi, Professor Emeritus, Tokai University /

Former Executive Director & Chief Director of Central Lab., Sony Corp.

PRINTED WIRING BOARDS EXPO Keynote Session - Jan. 17, 2008, 10:30-12:00

"The Future of Automotive Technology and the Evolution of Electronics"

Mr. Minoru Shinohara, Senior Vice President, Nissan Motor Co., Ltd.

IC PACKAGING TECHNOLOGY EXPO Keynote Session - Jan. 16, 2008, 13:30-15:00

"The Ever Evolving Automotive Electronics - Expected Evolution of Electronics and Semiconductors"

Mr. Takashi Shigematsu, Managing Officer, Toyota Motor Corp.

"Toshiba's Semiconductor Business Strategy and Expectation for Semiconductor Packaging Technology"

Mr. Shozo Saito, Corporate Senior Vice President, President and CEO, Semiconductor Co., Toshiba Corp.

Exhibitors will include:

Mounters: Yamaha Motors, I-Pulse, MyData Automation, Samsung Techwin, etc,

Printers/Masc: Newlong Seimetsu Kogyo, Mictrotech, Murakami, Sonokomu, etc.

Soldering Machines: Senju Metal Industry, Tamura, Koki, Harima Chemicals, etc.

Testers: Takaya, OHT, Kyoritsu Test System, Okano Electric, Newly-Tsuchiyama, etc.

Inspection: Agilent Technologies, OMRON, CKD, Saki, Shimadzu, Viscom AG, Anritsu, etc.

Measurement: Nagano Science, Graphtec, Horiba, Espec, Keyence, etc.

Flexible PCB: CMK, Nippon Mektron, Meiko Electronics, Aica Kogyo. etc.

Interposers: Samsung Electro-Mechanics, Eastern, Chino Giken, etc.

IC packaging-related equipment: Canon Machinery, Panasonid Factory Solutions, etc.

Subcontractors: Renesas, Fujitsu, Casio, Spansion, Pactech, Misuzu, Miyoshi, etc.

EMS / ODM: UMC Electronics, OMRON Nohogata, OKI, Takahata Electronica, etc.

Various Components: Amphenol Japan, Degson Electronics, TKK, Samtech Japan, etc.

Laser & Optics: OMRON Laserfront, Miyaichi, JSDU, SUNX, IPG Photonics, TRUMPF, etc.

For further details, please visit http://www.nepconworld.jp/english/

About NEPCON WORLD JAPAN

NEPCON WORLD JAPAN is the Asia's largest exhibition which gathers various electronics manufacturing and SMT-related products and technologies; and also semiconductor packaging technologies, components and materials; PCBs; test, inspection and measuring equipments, industrial laser and optical components. For more information, please visit www.nepconworld.jp/english/

Source: NEPCON WORLD JAPAN

Contact:

NEPCON WORLD JAPAN Show Management,
Reed Exhibitions Japan Ltd.
Hiroko Oda, Hajime Suzuki, Chisato Miyawaki
TEL : +81-3-3349-8502
FAX : +81-3-3349-4900
E-mail : inw-e@reedexpo.co.jp

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