Chips: Silicon Genesis Corporation and Komatsu Electronic Metals Solidify Joint Collaboration and Process Services Agreement

Edge: Work-Group Computing Report, Oct 12, 1998

Silicon Genesis Corporation and Komatsu Electronic Metals Co., Ltd. Monday announced a collaboration and process services agreement aimed at accelerating the development, qualification and acceptance of a new layer-transfer technology developed by Silicon Genesis for silicon-on-insulator (SOI) applications.

The new process, called the Genesis Process, combines unique processing steps and manufacturing tools designed to reduce cost and improve quality of current and new advanced semiconductor materials. SOI wafers are enhanced semiconductor wafers that enable the production of integrated circuits (ICs) with significant advantages over ICs constructed on conventional bulk silicon or epitaxial wafers. Rapid ramp-up by the two companies is already underway to fulfill the mass production demands of top chipmakers, projected at mid-1999.

Under the agreement, Komatsu Electronic Metals Co., Ltd. will apply its mass production technologies such as production engineering, quality evaluation techniques and quality assurance to the Silicon Genesis Plasma Implantation and Genesis Process technologies. The object of the collaboration is to confirm quality and manufacturability of the process in real-world production conditions. The agreement also includes terms for process services under which Silicon Genesis can supply SOI wafers to Komatsu Electronic Metals Co., Ltd. for evaluation and end-user customer sampling.

"This collaboration and process services agreement with Komatsu is a tangible measure of the progress Silicon Genesis has made in the past year towards becoming the leader in layer-transfer products such as SOI," stated Francois J. Henley, president and chief executive officer of Silicon Genesis Corporation. "Under this agreement, we expect to accelerate the acceptance of our SOI material both with end-customers and potential licensees of our process."

Kunimi Yoshimura, Managing Director and General Manager, Technical Development Division of Komatsu Electronic Metals Co., Ltd., said, "I am confident that the Genesis Process can be quickly integrated into Komatsu's SOI fabrication lines using our mass-production technologies. The new SOI material developed under this agreement show great promise for cost-effective manufacturing. Plasma ion immersion implant technology can also be applied to oxygen ion implantation. I have decided it is important to challenge the manufacture of a new SOI material of lower production cost, utilizing Silicon Genesis processes and equipment" About Komatsu Electronic Metals Co., Ltd

Komatsu Electronic Metals Co., Ltd. is a world renowned manufacturer of the full range of the state of art silicon wafers like CZ and FZ polished wafers, epitaxial wafers and hydrogen annealed wafers. Komatsu also owns manufacturing technologies for SIMOX wafers and bonded wafers to cater to the customers' requirements for SOI wafers. Komatsu is in pursuit of low cost SOI wafers and continues to challenge innovative technology. About Silicon Genesis Corporation

Silicon Genesis Corporation (SiGen) is an advanced materials company that offers plasma immersion ion implanters and supplies silicon-on-insulator (SOI) and other wafers to the microelectronics industry through internal manufacturing or process licensing. SiGen's goal is to be the world leader in advanced layer-transfer materials and wafers. SiGen is promoting the global acceptance of its layer-transfer wafers by continuing to develop advanced proprietary plasma ion implanters and process technology as well as by the formation of strategic alliances. Silicon Genesis Corporation's web site is http://www.sigen.com.