IBM and RF Micro Devices to Collaborate on Wireless Communications Chip Technology - Company Business and Marketing

Edge: Work-Group Computing Report, Oct 18, 1999

IBM and RF Micro Devices, Inc. Tuesday announced an agreement to jointly develop radio frequency integrated circuits (RFICs) based on IBM's silicon germanium (SiGe) process technology.

The two companies intend to design highly integrated RFICs for next-generation cell phones. This collaborative relationship is expected to dramatically reduce the number of chips in wireless handsets over time, shortening time-to-market for manufacturers, and resulting in smaller phones that use less power and offer longer battery life.

"Today's fast-paced wireless communications industry demands high performance, integrated solutions that help customers bring their products to market faster," said Michael Concannon, vice president of wireless communications at IBM Microelectronics. "The combination of IBM's proven SiGe process technology and RFMD's advanced RFIC design skills are expected to result in a new class of semiconductors for the next generation of mobile communications products."

"IBM's SiGe technology will enable us to design products that deliver high performance and low power consumption in wireless communications applications," said William J. Pratt, chief technical officer for RFMD. "We believe SiGe enhances RFMD's current approach of Optimum Technology Matching, where we match the process technology to the customer's application in order to minimize cost and deliver optimum performance."

SiGe is a process technology in which the standard silicon integrated circuit base of microchips is augmented with germanium to make the chips operate much faster with decreased power consumption. These chips can be used in a wide range of communications gear, boosting their performance while reducing their size and power consumption. SiGe also provides increased integration capabilities, enabling designers to build chips with more functions.

IBM introduced the industry's first standard high-volume SiGe chips in October 1998. Since then, IBM's SiGe technology has been adopted by a wide range of companies for a variety of applications, including RF components in cellular handsets and transmit/receive chipsets used in high speed fibre optic phone lines. Tuesday's announcement with RFMD continues the proliferation and use of IBM's SiGe technology in advanced communications systems.

IBM Microelectronics is a key contributor to IBM's role as the world's premier information technology supplier. IBM Microelectronics develops, manufactures and markets state-of-the-art semiconductor and interconnect technologies, products and services. Its superior integrated solutions can be found in many of the world's best-known electronic brands. More information about IBM Microelectronics can be found at http://www.chips.ibm.com.

RF Micro Devices, Inc. designs, develops, manufactures and markets proprietary RFICs for wireless communications applications such as cellular and PCS phones, cordless phones, wireless LANs, wireless local loop handsets, industrial radios, wireless security systems and remote meter readers. The Company offers a broad array of products -- including amplifiers, mixers, modulators/demodulators and single-chip transmitters, receivers and transceivers -- that represent a substantial majority of the RFICs required in wireless subscriber equipment. The Company's strategy is to focus on wireless markets by offering a broad range of standard and custom-designed RFICs in order to position itself as a "one-stop" solution for its customers' RFIC needs. FMI: http://www.rfmd.com.