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Power package for diodes and MOSFETs - International Pages - Brief Article - Product Announcement

Electronics Times, July 24, 2000

Toshiba's low-profile, miniature, surface mount power packages measure 9 x 10 x 2.8mm, and are expected to reduce the board mounting footprints of diodes and MOSFETs in applications such as power supplies, battery chargers and automotive systems.

The thin flat package (TFP) power semiconductor packaging maintains the same thermal resistance but combines higher power dissipation, with a volume reduction of 43% when compared with more conventional T0-220SM D2PAK devices.

The company's latest TFP-packaged 2SK3389 MOSFET has a power dissipation of 125W compared with the 100W rating of previous T0220 devices.

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At low voltages the packages will handle currents of up to 75A, while operation at lower currents increases voltage to around 600V.

Toshiba
Tel:  49 211 529 6254
Fax:  49 211 529 6400
Enquiry Number 521
COPYRIGHT 2000 Miller Freeman UK Ltd
COPYRIGHT 2000 Gale Group
 

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