Bibliography for: "Plastic package is a clear improvement"

"Plastic package is a clear improvement". Electronics Times. FindArticles.com. 01 Dec, 2009. http://findarticles.com/p/articles/mi_m0WVI/is_2001_March_12/ai_72275264/

Electronics Times

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Articles in March 12, 2001 issue of Electronics Times

• Nanoparticles in the making
• Net increase
• Going East - BF, LCD Microelectronics, Hong Kong - Brief Article
• Controller designed to cut costs and size - Intersil Inc., HFA3842 MAC medium access controller - Brief Article
• Powerful solution drives applications - Brief Article - Product Announcement
• Module powers into mobile networks - Brief Article - Product Announcement
• IR35 stays
• Densitron in US panel deal
• Everything comes in threes
• Mobiles still in doubt
• Game On
• D&T must be taught more
• Firms still keen to invest
• Students space out on wafers
• Partners in promotion
• Flint gets in the ACT for range in UK market - Advanced Crystal Technology, Flint Distribution - Brief Article
• Crystal offers cost effective alternative - Fox Electronics and Technology Inc - Brief Article
• Two converters work off 3 to 3.6V range - Elantec Inc., DC/DC converters - Brief Article
• Enclosures offer user a flexible option - OKW Enclosures - Brief Article
• Laser diode range is more reliable - Brief Article - Product Announcement
• New rules to assess IP
• Deltron step to the UK
• COG oils the wheels
• Plastic package is a clear improvement
• Bookham Staff Go
• Rubbish Dump
• Palmchip puts clamps on IPO
• Embedded staff go
• UK: time to mind the gap
• Solder Success
• Gothic Deal - Gothic Components to distribute Tyco Electronics Corp.'s Tyco-Schrack line of relays - Brief Article
• Kit supports 8bit MCU family - Unique Memec, Picstart Plus programming kit - Brief Article
• DC/DC controller delivers up to 10W - Brief Article - Product Announcement
• Contact repair kit features mini pens - Brief Article - Product Announcement
• Devices enter market with a SuperFlash
• PanelX adds display parts
• Speedy converters offer low dissipation
• UK firms bypass vital EMC tests
• ADSL deadline connection set
• OS problem for Cisco
• Japanese join on display technology
• Order Book
• Adaptive uses new logic
• Change of image
• ACC poised for embedded gain
• Resistor arrays suit volume applications - Ohmite Manufacturing Co - Brief Article
• Potentiometer in plastic for transducer - Brief Article - Product Announcement
• CE17 alloy is a copper alternative - International Pages - Brief Article - Product Announcement
• Single chip solution aids DVD-rom drives - International Pages - Brief Article - Product Announcement
• Photonics on way to Intel line
• Future joins Intersil for global line-up
• Absorbing Film
• Firms keeping hold of excess
• Minimum wage rise accepted by lobby groups
• IP developers' bid for funding
• A Date With Venus
• In the business of growing
• Second deal for Future
• Rad-hard MOSFET for management circuits - Brief Article - Product Announcement
• Filters part upstream from downstream
• Diamond focus on interfacing
• Mixed signal first on 0.13 micro m
• Phone sales slow at Alcatel
• UK is still not so very green
• Defects force silicon to act as light source
• Baseband LSI offers three main features
• IP cores and HDL modules in no code link
• The ageing process
• Yahoo links up with Partminer - Yahoo! Inc., Partminer Inc - Brief Article
• Panels target 19in enclosures - Olson Electronics, distribution panels - Brief Article
• Connectors have dB loss of less than 0.5 - International Pages - Brief Article - Product Announcement
• Link provides mission critical solution - Brief Article
• DoCoMo's #3m spend in Europe
• Extra Specialist
• What's in a name?
• Vodafone puts cash into GPRS
• Intel cuts prices by up to 20% to boost P4
• PPP for Daresbury
• Nano For The Masses - Brief Article
• Tool talks in SystemC

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