Japan Radio Co. Licenses CEVA-Teak DSP Core for Baseband Radio Communications

CEVA, Inc. (NASDAQ: CEVA), (LSE: CVA) the leading licensor of Digital Signal Processor (DSP) cores and communications solutions to the semiconductor industry, today announced that Japan Radio Co., Ltd. (TSE: 6751), a leading manufacturer of electronic professional communication equipment, has licensed the CEVA-Teak(TM) DSP core to power their baseband radio communication solutions. Japan Radio Co., Ltd. (JRC) is embedding CEVA-Teak DSP Core in a baseband chip for it's communications equipment to deliver complete signal processing.

CEVA-Teak's core and architecture facilitates JRC's capabilities to easily create low-power consumption, high-performance DSP sub-systems. By deploying CEVA-Teak in it's System-on-Chip (SoC) solution, JRC is able to design and build an efficient solution for a market that requires high speed applications with absolute consistency over wide distances. The DSP sub-system communicates via a multi-layered bus, is coupled with a JRC proprietary DMA and is integrated with a RISC sub-system from a CPU.

"The importance of incorporating a market proven DSP core and the ease of integration into our SoC was critical in providing the right solution for this project," said Keiichi Nonaka, general manager of Mobile Communications R&D of JRC. "JRC is committed to high performance solutions and we are glad to have CEVA become a part of our team."

"Working together with JRC, a leading producer of electronic platforms, extends the range of markets that exploit CEVA DSP cores for baseband applications," commented Gideon Wertheizer, EVP and CTO of CEVA. "DSP technology is fundamental in the growth of next-generation radio communications platforms and JRC's DSP core chipset underlines the advantages in creating an architecture for system-on-chip solutions with CEVA DSP cores."

About CEVA-Teak

CEVA-Teak is a 16-bit fixed-point general-purpose DSP core. Its dual MAC architecture features high-performance, high flexibility and throughput for complex Digital Signal Processing implementations. The core is designed for low-power, speech and audio processing, multimedia and wireless communications (GSM, CDMA, EDGE, GPRS, 3G, etc.), high-speed modems, advanced telecommunication systems, and various embedded control applications. CEVA-Teak is designed with consideration for low-power consumption to achieve the best possible performance with the lowest possible power consumption. It makes the core suitable to a wide variety of battery-powered portable applications.

CEVA and CEVA-Teak are registered trademarks CEVA, Inc. Other brands and products referenced herein are the trademarks or registered trademarks of their respective holders.

About CEVA, Inc.

Headquartered in San Jose, California, CEVA (NASDAQ: CEVA) and (LSE: CVA) is the leading licensor of DSP cores and communications solutions to the semiconductor industry. CEVA markets a portfolio of DSP IP in three integrated areas: CEVA DSPs, CEVA Open Framework Environment and CEVA Xpert Applications, all supported by CEVA Services. CEVA's products are used in over 80 million devices each year. CEVA was created through the merger of the DSP licensing division of DSP Group and Parthus Technologies. For more information visit www.ceva-dsp.com

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