OMAC Packaging Workgroup to present at PackExpo

InTech, Oct 2006

The OMAC Packaging Workgroup (OPW) will be at PackExpo (29 October-2 November) in Chicago's McCormick Place. The OPW booth will feature seven demonstration units showing implementation of PackML, PackConnect, and PackSoft guidelines. These demonstration units will feature hardware and software from 17 technology suppliers and one machine builder. They include: Elau, Pneumatic Scale, AMK, Baumuller, Beckhoff, SEW, B&R, Baldor, Lenze, Parker, Danfoss, Siemens, Rockwell, Yaskawa, and Waao.

The demonstrations, with participation from most of the major technology suppliers in packaging automation, show the broad support the industry is giving OPW guidelines. These technology suppliers are also helping educate machine builders and users about the benefits of these guidelines.

For more information, visit OPW at www.omac.org/packaging.