IBM Journal of Research and Development

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Articles in Sep 1998 issue of IBM Journal of Research and Development

• Polarographic methods of monitoring addition agents in the electroplating of Sn-Pb solders
  by Horkans, J
• Microfabrication by electrochemical metal removal
  by Datta, M
• Photoelectrochemical etching of semiconductors
  by Kohl, P A
• Applications of electrochemical microfabrication: An introduction
  by Datta, M
• Electrolessly deposited diffusion barriers for microelectronics
  by O'Sullivan, E J; Schrott, A G; Paunovic, M; Sambucetti, C J; Et al
• Damascene copper electroplating for chip interconnections
  by Andricacos, P C; Uzoh, C; Dukovic, J O; Horkans, J; Deligianni, H
• Electrochemical process for advanced package fabrication
  by Krongelb, S; Romankiw, L T; Tornello, J A
• Electrochemical microfabrication by laser-enhanced photothermal processes
  by Gutfeld, R J von; Sheppard, K G
• Future directions in electroplated materials for thin-film recording heads
  by Andricacos, P C; Robertson, N
• Integrated, variable-reluctance magnetic minimotor
  by O'Sullivan, E J; Cooper, E I; Romankiw, L T; Kwietniak, K T; Et al
• Thin-film multichip module packages for high-end IBM servers
  by Perfecto, E D; Giri, A P; Shields, R R; Longworth, H P; Et al
• Metallization by plating for high-performance multichip modules
  by Wong, K K H; Kaja, S; DeHaven, P W