Metallization by plating for high-performance multichip modules

IBM Journal of Research and Development, Sep 1998 by Wong, K K H, Kaja, S, DeHaven, P W

Acknowledgment

This paper summarizes several years of effort by many individuals within the IBM Microelectronics and Research Divisions. In particular, the authors wish to thank L. T. Romankiw, P. C. Andricacos, J. O. Dukovic, J. Horkans, Y. L. Lee, K. Semkow, H. Liu, C. Prasad, E. Perfecto, and G. White.

1C4: Controlled Collapse Chip Connection.

*Trademark or registered trademark of International Business Machines Corporation.

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