IBM Journal of Research and Development
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Articles in Nov 2002 issue of IBM Journal of Research and Development
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Early analysis tools for system-on-a-chip design
by Darringer, J A; Bergamaschi, R A; Bhattacharya, S; Brand, D; Et al -
Issues and strategies for the physical design of system-on-a-chip ASICs
by Bednar, T R; Buffet, P H; Darden, R J; Gould, S W; Zuchowski, P S -
High-end server low-temperature cooling
by Schmidt, R R; Notohardjono, B D -
A power, packaging, and cooling overview of the IBM eServer z900
by Singh, P; Ahladas, S J; Becker, W D; Bosco, F E; Et al -
An advanced mulichip module (MCM) for high-performance UNIX servers
by Knickerbocker, J U; Pompeo, F L; Tai, A F; Thomas, D L; Et al -
Land grid array sockets for server applications
by Corbin, J S; Ramirez, C N; Massey, D E -
Design and analysis of a scheme to mitigate condensation on an assembly used to cool a processor module
by Ellsworth, M J Jr; Schmidt, R R; Agonafer, S -
Preface: System-on-a-chip
by Reeves, Thomas M; Ravey, Timothy K -
Preface: Packaging
by Cozzolino, Vincent; Singh, Prabjit -
IBM ASIC/SoC methodology--a recipe for first-time success, The
by Doerre, G W; Lackey, D E -
Embedded DRAM design and architecture for the IBM 0.11-(mu)m ASIC offering
by Barth, J E Jr; Dreibelbis, J H; Nelson, E A; Anand, D L; Et al
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