Journal of Electronic Materials

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Articles in Oct 2000 issue of Journal of Electronic Materials

• "discovery" of alpha activity in lead and solder, The
  by Brodzinski, Ron
• A comparative study of the kinetics of interfacial reaction between eutectic solders and Cu/Ni/Pd metallization
  by Ghosh, G
• Correction factors for area array alpha detectors
  by Roberson, M W
• Ensuring the reliability of alpha counting
  by Schindlbeck, Guenter
• Effect of soldering and aging time on interfacial microstructure and growth of intermetallic compounds between Sn-3.5Ag solder alloy and Cu substrate
  by Choi, Won Kyoung; Lee, Kyuck Mo
• Copper substrate dissolution in eutectic Sn-Ag solder and its effect of microstructure
  by Chada, S; Fournelle, R A; Laub, W; Shangguan, D
• Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys
  by Moon, K -W; Boettinger, W J; Kattner, U R; Biancaniello, F S; Handwerker, C A
• effect of solder paste residues on RF signal integrity, The
  by Turbini, Laura J; Smith, Brian A; Brokaw, James; Williams, John; Gamalski, Jurgen
• Thermomechanical fatigue behavior of Sn-Ag solder joints
  by Choi, S; Subramanian, K N; Lucas, J P; Bieler, T R
• Phase equilibria and the related properties of Sn-Ag-Cu based Pb-free solder alloys
  by Ohnuma, I; Miyashita, M; Anzai, K; Liu, X J; Et al
• Clean galena, contaminated lead, and soft errors in memory chips
  by Lykken, G I; Hustoft, J; Ziegler, B; Momcilovic, B
• Reliability of composite solder bumps produced by an in-situ process
  by Lee, Jong-Hyun; Park, Daejin; Moon, Jong-Tae; Lee, Yong-Ho; Et al
• Characteristics of the Sn-Pb eutectic solder bump formed via fluxless laser reflow soldering
  by Lee, Jong-Hyun; Park, Daejin; Moon, Jong-Tae; Lee, Yong-Ho; Et al
• Interfacial reaction and solder joint reliability of Pb-free solders in lead frame chip scale packages (LF-CSP)
  by Yoon, Seung Wook; Park, Chang Jun; Hong, Sung Hak; Moon, Jong Tae; Et al
• Inhibiting growth of the Au(0.5)Ni(0.5)Sn(4) intermetallic layer in Pb-Sn solder joints reflowed on Au/Ni metallization
  by Minor, A M; Morris, J W Jr
• Analysis of ring and plug shear strengths for comparison of lead-free solders
  by Foley, J C; Gickler, A; Leprevost, F H; Brown, D
• Long-term aging study on the solid-state reaction between 58Bi42Sn solder and Ni substrate
  by Chen, C; Ho, C E; Lin, A H; Luo, G L; Kao, C R
• Effects of reflow on wettability, microstructure and mechanical properties in lead-free solders
  by Guo, F; Choi, S; Lucas, J P; Subramanian, K N
• Ag and Cu migration phenomena on wire-bonding
  by Hsieh, Ker-Chang; Martens, Theo
• Characterization of electroplated bismuth-tin alloys for electrically conducting materials
  by Kang, S K; Buchwalter, S; Tsang, C
• Reactions of lead-free solders with CuNi metallizations
  by Korhonen, T M; Su, P; Hong, S J; Korhonen, M A; Li, C -Y