Kinetics of Au-containing ternary intermetallic redeposition at solder/UBM interface

Journal of Electronic Materials, Sep 2001 by Lee, Jong-Hyun, Park, Jong-Hwan, Shin, Dong-Hyuk, Lee, Yong-Ho, Kim, Yong-Seog

In this study, the effects of the under bump metallurgy (UBM) structure and Cu content in solders on the redeposition rate of Au-containing ternary intermetallies at the solder/UBM interface were investigated. A UBM structure with a Ni diffusion barrier, Au/Ni/Cu, appeared to promote the redeposition of ternary Aucontaining intermetallics at the solder/UBM interface of the ternary during the solid-state aging treatment and the Au-embrittlement of the solder interconnections. Copper added to the eutectic Sn-Pb and Sn-Ag solders was observed to be very effective in retarding the redeposition by forming the ternary intermetallics in solder matrices and preventing the Au-embrittlement. These phenomena were discussed with the microstructures observed.

Key words: Au-embrittlement, aging treatment, Au-containing ternary intermetallic, redeposition, fracture energy

ACKNOWLEDGEMENTS

The authors would appreciate the financial support (#1999-2-301-007-4) from the Korea Science and Engineering Foundation (KOSEF) for this study.

(Received February 13, 2001; accepted May 16, 2001)

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JONG-HYUN LEE,1 JONG-HWAN PARK,1 DONG-HYUK SHIN,2,3 YONG-HO LEE,1 and YONG-SEOG KIM1,3

1.-Hong Ik University, Department of Metallurgy and Materials Science, Seoul, Korea.

2.-Hanyang University, Department of Metallurgy and Materials Science, Ansan, Korea.

3-Jointly appointed by CAAM at POSTECH