Plastic deformation kinetics of electrodeposited Cu foil at low and intermediate homologous temperatures

Journal of Electronic Materials, Apr 2002 by Conrad, Hans, Yang, Di

The plastic deformation kinetics of electrodeposited (EP) Cu foil (grain size d = 0.6 (mu)m) were determined at 296-448 K and compared with those for vapor-deposited (VP) foil (d = 0.5 (mu)m) tested at 77-473 K. The apparent activation volume v = kT d In epsilon/d(sigma) for both materials exhibited a minimum at -350 K, and at this temperature, there occurred a marked increase in the temperature dependence of the flow stress sigma. The rate-controlling mechanism in both materials at T

Key words: Grain size, grain boundary shear, dislocation pileup, cross slip, intersection of dislocations

ACKNOWLEDGEMENTS

The authors express their appreciation to Dr. H. Merchant, Gould Electronics, for providing the EP Cu foil, the TEM micrographs, and the grain-size distribution measurements. They also thank him for reviewing the manuscript and offering stimulating and helpful comments.

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HANS CONRAD and DI YANG

Materials Science and Engineering Department, North Carolina State University, Raleigh, NC 27695-7907