Journal of Electronic Materials

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Articles in Sep 2002 issue of Journal of Electronic Materials

• Evaluation of the mechanical properties of a ternary Sn-20In-2.8Ag solder
  by Yeh, M S
• Low-resistance and thermally stable Pd/Ru ohmic contacts to p-type GaN
  by Jang, Ja-Soon; Lee, Chang-Won; Park, Seong-Ju; Seong, Tae-Yeon; Ferguson, I T
• Effect of heating on the electrical resistivity of conductive adhesive and soldered joints
  by Kim, Kyu Dong; Chung, D D L
• Microstructure and mechanical properties of new lead-free Sn-Cu-RE solder alloys
  by Wu, C M L; Yu, D Q; Law, C M T; Wang, L
• thermal property of lead-free Sn-8.55Zn-1Ag-XAl solder alloys and their wetting interaction with Cu, The
  by Cheng, Shou Chang; Lin, Kwang Lung
• properties of Sn-9Zn lead-free solder alloys doped with trace rare earth elements, The
  by Wu, C M L; Yu, D Q; Law, C M T; Wang, L
• Residual-mechanical behavior of thermomechanically fatigued Sn-Ag based solder joints
  by Lee, J G; Guo, F; Choi, S; Subramanian, K N; Et al
• Electrical characterization of isotropic conductive adhesive under mechanical loading
  by Mo, Zhimin; Wang, Xitao; Wang, Tiebing; Li, Shiming; Et al
• Phase equilibria and solidification properties of Sn-Cu-Ni alloys
  by Lin, Shih-Hao; Chen, Sinn-Wen; Wang, Chao-Hong
• Electrical properties of carbon nitride thin films: Role of morphology and hydrogen content
  by Broitman, E; Hellgren, N; Neidhardt, J; Brunell, I; Hultman, L