Journal of Electronic Materials

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Articles in Jun 2003 issue of Journal of Electronic Materials

• Wide and narrow bandgap semiconductors for power electronics: A new valuation
  by Hudgins, Jerry L
• Optimization of pretreatment for liquid-phase deposition of SiO^sub 2^ on ARTON plastic substrate
  by Huang, C J; Shih, W C
• Electron backscattered diffraction and energy dispersive X-ray spectroscopy study of the phase NiSn^sub 4^
  by Boettinger, W J; Vaudin, M D; Williams, M E; Bendersky, L A; Wagner, W R
• Investigation of Ti/Al and TiN/Al thin films as the stable ohmic contact for p-Type 4H-SiC
  by Lee, Byung-Teak; Shin, Jong-Yoon; Kim, Seon-Hoon; Kim, Jin-Hyeok; Et al
• Effects of dimple and metal coating on interfacial adhesion in plastic packages
  by Lebbai, Mohamed; Kim, Jang-Kyo; Yuen, Matthew M F
• Creep rupture of lead-free Sn-3.5Ag-Cu solders
  by Joo, D K; Yu, Jin; Shin, S W
• Effects of moisture and elevated temperature on reliability of interfacial adhesion in plastic packages
  by Lebbai, Mohamed; Kim, Jang-Kyo; Yuen, Matthew M F
• Plasma-enhanced chemical-vapor deposition oxide prepared at low-flow conditions for course wavelength-division multiplexing optical-waveguide devices
  by Chu, A K; Lin, J Y; Wang, M L; Fan, C C; Et al
• Activation energy determination for recrystallization in electroplated-copper films using differential scanning calorimetry
  by Donthu, Suresh K; Vora, Mehul M; Lahiri, S K; Thompson, Carl V; Yi, S
• High resistivity measurement of SiC wafers using different techniques
  by Muzykov, P G; Khlebnikov, Y I; Regula, S V; Gao, Y; Sudarshan, T S
• Analysis of physical properties of III-nitride thin films by nanoindentation
  by Jian, Sheng-Rui; Fang, Te-Hua; Chuu, Der-San
• Interfacial microstructure and intermetallics developed in the interface between In solders and Au/Ni/Ti thin films durings reflow process
  by Shin, Keesam; Cho, Won-Gu; Kim, Young-Ho
• Positron-defect profiling in Cd^sub 1-x^Zn^sub x^Te wafers after saw cutting
  by McNeil, Sean P; Lynn, Kelvin G; Weber, Marc H; Szeles, Csaba; Soundararajan, Raji
• Optimization of black oxide coating thickness as an adhesion promoter of copper substrate in plastic integrated-circuit packages
  by Lebbai, Mohamed; Kim, Jang-Kyo; Szeto, W K; Yuen, Matthew M F; Tong, Pin
• Adhesion Strength of the Sn-9Zn-xAg/Cu Interface
  by Chang, Tao-Chih; Hon, Min-Hsiung; Wang, Moo-Chin
• Predicting tensile properties of the bulk 96.5Sn-3.5Ag lead-free solder
  by Cheng, Yi-Wen; Siewert, Thomas A
• Effect of Dwell Times on Thermomechanical Fatigue Behavior of Sn-Ag-Based Solder Joints
  by Lee, J G; Subramanian, K N
• A Study on Interfacial Reactions between Electroless Ni-P Under Bump Metallization and 95.5Sn-4.0Ag-0.5Cu Alloy
  by Jeon, Young-Doo; Nieland, Sabine; Ostmann, Andreas; Reichl, Herbert; Paik, Kyung-Wook