Lead-Free Interconnect Technique by Using Variable Frequency Microwave

Journal of Electronic Materials, Jul 2005 by Moon, Kyoung-Sik, Li, Yi, Xu, Jianwen, Wong, C P

The results of this study demonstrate the probable application of VFM technology for low temperature lead-free soldering.

ACKNOWLEDGEMENTS

The authors thank the National Science Foundation and the Environmental Protection Agency for partial financial support for this research (NSF Grant No. DMI-0217910 and EPA Grant No. RD-83148901). They also thank Dr. Zhuqing Zhang and Mr. Hongjin Jiang with the Georgia Institute of Technology for the reflow process and sample preparation.

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KYOUNG-SIK MOON,1 YI LI,1 JIANWEN XU,1 and C.P. WONG1,2

1.-School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0245. 2.-E-mail: cp.wong@mse.gatech.edu