Bibliography for: "Lead-Free Interconnect Technique by Using Variable Frequency Microwave"

Moon, Kyoung-Sik "Lead-Free Interconnect Technique by Using Variable Frequency Microwave". Journal of Electronic Materials. FindArticles.com. 19 Dec, 2009. http://findarticles.com/p/articles/mi_qa3776/is_200507/ai_n14777490/

Journal of Electronic Materials

View more issues:

Articles in Jul 2005 issue of Journal of Electronic Materials

• High-Temperature Variable Melting Point Sn-Sb Lead-Free Solder Pastes Using Transient Liquid-Phase Powder Processing
  by Corbin, S F
• Fabrication and Thermal Evaluation of Silicon on Diamond Wafers
  by Aleksov, A; Wolter, S D; Prater, J T; Sitar, Z
• Ion Bombardment-Induced High Orientation of Al/Ti Films for Surface Acoustic Wave Device Applications
  by Li, D M; Pan, F; Niu, J B; Liu, M
• Electron Beam-Induced Current Investigation of GaN Schottky Diode
  by Matoussi, A; Boufaden, T; Guermazi, S; Mlik, Y; Et al
• Enhanced Gettering of Iron Impurities in Bulk Silicon by Using External Direct Current Electric Field
  by Lee, W P; Teh, E P; Yow, H K; Choong, C L; Tou, T Y
• High Electric-Field-Induced Strain Behavior of Single-Crystal Pb(Mg^sub 1/3^Nb^sub 2/3^)O^sub 3^-xPbTiO^sub 3^ Multilayer Piezoelectric Actuators
  by Feng, Zuyong; Li, Haimei; Luo, Haosu; Jin, Weiqing
• Scanning Electron Microscopy Study of the Cross Section of Intermetallic Compound in the Solder Ball on the Plastic Ball Grid Array Package Following Reliability Tests
  by Duann, Yeh-Fang; Chiang, Jen-Hung; Yang, Shung-Jim; Chang, Hsun-Wen
• Lead-Free Interconnect Technique by Using Variable Frequency Microwave
  by Moon, Kyoung-Sik; Li, Yi; Xu, Jianwen; Wong, C P
• Influence of Flux on Wetting Behavior of Lead-Free Solder Balls during the Infrared-Reflow Process
  by Chung, Cho-Liang; Moon, Kyoung-Sik; Wong, C P
• Hemisphere-Shaped Silicon Crystal Wafers Obtained by Plastic Deformation and Preparation of Their Solar Cells
  by Nakajima, Kazuo; Fujiwara, Kozo; Pan, Wugen