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Wafer-level: advanced packaging technology.

Despite broad declines in the overall semiconductor market segment in recent years, demand for advanced packaging technology continues to rise....
Semiconductor International, 02/01/04 by Ranjan, Manish; Zafiropoulo, Scott; Kay, Stephen; Goodman, Thomas; Elenius, Peter · More from publication -
Stepper tech overcomes packaging problems - Comment - wafer-level, chip-scale packaging for DRAMs - Editorial
THE TREND OF MINIATURIZing devices has pushed assembly and packaging toward the adoption of wafer-level, chip-scale packaging (WLCSP). THE TREND...
Electronic News, 05/20/02 by Manish Ranjan · More from publication



